&lt;p&gt;Electronics packaging is a complex technology development issue that requires coordinated optimized solutions at the component (chip), subsystem (board) and system (spacecraft/instrument) levels.&amp;nbsp; The proposed effort will develop intelligent structural-thermal capabilities embedded into a multi-functional structure.&amp;nbsp; Embedded electrohydrodynamic (EHD) thermal control subsystem will enable lighter, more compact packaging capable of greater heat transport than the current state of the art (conduction and radiation).&amp;nbsp; Future spacecraft electronics subsystems may contain electronics components directly integrated into the board at a greater component density (more components) than currently possible due to thermal constraints. This structure will ultimately reduce the number of boards required (mass and volume savings). Furthermore, convective, two-phase embedded thermal control subsystems significantly reduce the overall thermal resistance and will allow remote heat rejection at higher temperatures than those currently attained by electronics thermal control packages.&amp;nbsp; The spacecraft realizes significant mass and volume savings with smaller, more effective radiators.&lt;/p&gt;&lt;p&gt;&amp;nbsp;&lt;/p&gt;&lt;p&gt;Additive manufacturing techniques are advanced manufacturing processes that build up a structure or device layer by layer.&amp;nbsp; Additive manufacturing processes have not yet been applied to multifunctional structure applications.&amp;nbsp; The self-sensing thermal/strain system will require a material with homogenous electrical and thermal properties as temperature and strain will be measured using resistivity.&amp;nbsp; Furthermore, the thermal subsystem will require small channel hydraulic diameters.&amp;nbsp;&amp;nbsp; Each of these subsystems will be directly integrated at the &amp;lsquo;layer&amp;rsquo; level determined to provide for optimal structural and thermal performance.&amp;nbsp;&amp;nbsp; Thus, candidate materials include both metals and nano-enhanced polymers whose properties can be engineered to meet project requirements. These requirements are ideal for multifunctional structures: strict manufacturing tolerances, small-scale features, and advanced materials.&amp;nbsp; The investigation at hand will advance additive manufacturing techniques and processes by combining self-sensing (temperature-stress/strain), complex embedded thermal hardware (EHD electrodes), structural capabilities, wiring board and grounding plane into a single, homogenous device.&lt;/p&gt;